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Headers, Receptacles, Female Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Connector Type | Contact Type | Style | Number of Positions | Number of Positions Loaded | Pitch - Mating | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Insulation Color | Insulation Height | Contact Length - Post | Operating Temperature | Material Flammability Rating | Contact Finish - Post | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) | Voltage Rating |
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CLT-134-02-H-D-PLOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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CLT-143-02-SM-D-A-KLOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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CLH-144-H-D-DVCLH-144-H-D-DV |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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CLP-140-02-H-D-KLOW PROFILE DUAL-WIPE SOCKET, .0 |
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CLP | - | Active | Receptacle | Female Socket | Board to Board | 80 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact | ||
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ESQT-135-02-M-6-375CONN SOCKET 210P 0.079 GOLD PCB |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 210 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | 0.475" (12.07mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | ||
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ESQT-135-02-M-6-690CONN SOCKET 210P 0.079 GOLD PCB |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 210 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.690" (17.52mm) | 0.160" (4.06mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | ||
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ESQ-133-38-G-TCONN SOCKET 99POS 0.1 GOLD PCB |
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Datasheet |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 99 | All | 0.100" (2.54mm) | 3 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.7A per Contact | ||
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FOLC-135-04-S-QCONN RCPT 140POS 0.05 GOLD PCB |
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FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | Board to Board | 140 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.180" (4.57mm) | 0.120" (3.05mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 2.6A per Contact | ||
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534974-8CONN RCPT 150P 0.1 GOLD PCB R/A |
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Datasheet |
AMPMODU Mod II | Tube | Active | Receptacle | Female Socket | Board to Board | 150 | All | 0.100" (2.54mm) | 3 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | - | 0.338" (8.59mm) | 0.115" (2.92mm) | - | - | - | - | Guide Pin Ears | - | ||
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CLT-144-02-SM-D-KLOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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CLT-140-02-SM-D-BE-KLOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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FOLC-135-M1-L-QCONN RCPT 140P 0.05 GOLD SMD T/H |
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FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | Board to Board | 140 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Surface Mount, Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.185" (4.70mm) | 0.075" (1.91mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 2.6A per Contact | ||
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CLT-143-02-H-D-PLOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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YTE-145-03-L-Q-3452.00 MM FLEXYZ HIGH-DENSITY ELEV |
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Datasheet |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 180 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.345" (8.76mm) | - | -55°C ~ 105°C | - | - | - | - | - | ||
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CLT-131-02-H-D-BE-ALOW PROFILE DUAL WIPE SOCKET, 2. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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ESD-130-G-03CONN SOCKET 60POS 0.1 GOLD PCB |
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Datasheet |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 60 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.300" (7.62mm) | 0.153" (3.89mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - | ||
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ESD-128-G-23CONN SOCKET 56POS 0.1 GOLD PCB |
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Datasheet |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 56 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.300" (7.62mm) | 0.115" (2.92mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - | ||
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CLP-148-02-STL-DLOW PROFILE DUAL-WIPE SOCKET, .0 |
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CLP | - | Active | Receptacle | Female Socket | Board to Board | 96 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact | ||
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ESD-126-G-05CONN SOCKET 52POS 0.1 GOLD PCB |
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Datasheet |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 52 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.500" (12.70mm) | 0.165" (4.19mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - | ||
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CLP-137-02-H-D-BELOW PROFILE DUAL-WIPE SOCKET, .0 |
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CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 74 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
